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Hybrid microcircuits provide an ideal technology when space, quality, and performance are required
and volumes don’t justify an expensive ASIC solution. Whether you need hermetically sealed
MIL-PRF 38534 Class H, value engineered all in one 3kW power modules, or environmentally robust
commercial hybrids BI Technologies has your solution. Hybrid Microcircuits Index –
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High Reliability Hybrids
Application Notes |
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| MODEL |
DESCRIPTION |
ASSEMBLY |
PACKAGE |
SUBSTRATE |
OPERATING TEMPERATURE |
| 165 Series |
Custom Hybrid Microcircuit or MCM |
Resistors, |
Hermetic Metal, Ceramic, Plastic Encapsulated |
Thick Film, Thin Film |
-55°C to +125°C Optional: Up to +200° |
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Applications: Avionic Systems, Communication Guidance/Control Systems, Medical Implantables, High Temperature , Environments |
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Power Modules
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Application Notes |
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| MODEL |
DESCRIPTION |
ASSEMBLY |
PACKAGE |
SUBSTRATE |
OPERATING
TEMPERATURE |
|
170 Series |
Custom Module, Power Switching up to 500 Amp Peak |
Solder Mounted Die, High Current Traces Insulated Backplate |
Encapsulated, Integral Mounting Flange | Direct Bond Copper (DBC) |
-40°C to +125°C |
| 7700 Series |
Standard 20 Amp, 25 Amp Power Factor Correction Module (PFC) |
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| 7720 Series |
Standard 10 Amp, 15 Amp, 20 Amp Power Factor Correction Module (PFC) |
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| 22 Amp, 32 Amp H-Bridge Modules w/Thermal Protection |
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| Applications: Power Supplies, Motor Drive/Controls, DC/DC Converters, UPS, Audio Amplifiers | |||||
Commercial Hybrids
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| MODEL |
DESCRIPTION |
ASSEMBLY |
PACKAGE |
SUBSTRATE |
OPERATING TEMPERATURE |
| Custom module |
Surface Mount Components substrate w/Integral |
Open Frame Conformal Coated Encapsulated Polymer Housing |
Thick Film Ceramic |
0°C to +70°C (Standard:) -25°C to +85°C (Optional:) |
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| Temperature Compensation module |
Surface Mount Components substrate w/Integral Resistors | Open Frame SIP |
Thick Film Ceramic | -40°C to +80°C (Standard:) |
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| Applications: Industrial, Automotive, Portable Electronics, White Goods, Telecommunications | |||||